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Advances in CMP/polishing technologies for the manufacture of electronic devices /

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R & D accessible to the wider engineering community.

Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Doi, Toshiro (Editor ), Marinescu, Ioan D. (Editor ), Kurokawa, Syuhei (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Oxford : William Andrew, 2012.
Edición:1st ed.
Temas:
Acceso en línea:Texto completo

MARC

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007 cr mn|||||||||
008 111222s2012 enka o 001 0 eng d
040 |a HKP  |b eng  |e pn  |c HKP  |d HKP  |d OPELS  |d TEF  |d B24X7  |d OCLCQ  |d CDX  |d OCLCF  |d ZCU  |d YDXCP  |d OCLCQ  |d UIU  |d OCLCQ  |d STF  |d OCLCQ  |d U3W  |d COO  |d CNNAI  |d WYU  |d LEAUB  |d OL$  |d OCLCO  |d OCLCQ  |d OCLCO 
019 |a 858453460 
020 |a 9781437778595 
020 |a 1437778593 
035 |a (OCoLC)769153733  |z (OCoLC)858453460 
050 4 |a TS670  |b .A386 2012eb 
082 0 4 |a 671.7/2  |2 23 
245 0 0 |a Advances in CMP/polishing technologies for the manufacture of electronic devices /  |c edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa. 
250 |a 1st ed. 
260 |a Oxford :  |b William Andrew,  |c 2012. 
300 |a 1 online resource (xii, 317 pages) 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
520 |a CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R & D accessible to the wider engineering community. 
500 |a Includes index. 
650 0 |a Electrolytic polishing. 
650 0 |a Grinding and polishing. 
650 6 |a Polissage �electrolytique.  |0 (CaQQLa)201-0077168 
650 7 |a electropolishing.  |2 aat  |0 (CStmoGRI)aat300053872 
650 7 |a Electrolytic polishing  |2 fast  |0 (OCoLC)fst00906510 
650 7 |a Grinding and polishing  |2 fast  |0 (OCoLC)fst00947952 
700 1 |a Doi, Toshiro.  |4 edt 
700 1 |a Marinescu, Ioan D.  |4 edt 
700 1 |a Kurokawa, Syuhei.  |4 edt 
856 4 0 |u https://sciencedirect.uam.elogim.com/science/book/9781437778595  |z Texto completo