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Advances in CMP/polishing technologies for the manufacture of electronic devices /

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R & D accessible to the wider engineering community.

Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Doi, Toshiro (Editor ), Marinescu, Ioan D. (Editor ), Kurokawa, Syuhei (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Oxford : William Andrew, 2012.
Edición:1st ed.
Temas:
Acceso en línea:Texto completo
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Publicado 2012
Texto completo
Electrónico eBook