Introduction to system-on-package (SOP) : miniaturization of the entire system /

"System-on-Package (SOP) is an emerging system technology that goes beyond System-on-Chip (SOC) and System-in-Package (SIP) and forms the basis of all emerging digital convergent electronic and bioelectric systems. This book on SOP shows designers how this revolutionary new packaging technology...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Tummala, Rao R., 1942- (Autor)
Otros Autores: Swaminathan, Madhavan, Bandyopadhyay, Tapobrata, Mehendale, Mahesh, Rao, Jagdish, Lee, Baik-Woo, Yoon, Chong K., Brown, Kenneth M., Engin, A. Ege, Govind, Vinu, Bavisi, Amit, Papapolymerou, John, Tentzeris, Manos, Laskar, Joy, Bhattacharya, Swapan, Chang, Gee-Kung, Gaylord, Thomas, Vallalaz, Ricardo, Guidotti, Daniel, Chen, Ray T., Sundaram, Venky, Liu, Fuhan, Krishnan, Ganesh, White, George, Kohl, Paul, Raj, P. Markondeya, Pucha, Raghuram V., Qu, Jianmin, Sitaraman, Suresh K., Monajemi, Pejman, Ayazi, Farrokh, Sparks, Douglas, Zhang, Zhuqing, Li , Y., Wong, C. P., Joshi, Y., Jha, Gopal C., Patterson, M., Dutta, P., Akbay, S. S., Keezer, D., Chatterjee, A., Janagama, Dasharathan G., Liu, Jin, Iyer, Mahadevan K.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, N.Y. : McGraw-Hill Education, [2008]
Edición:First edition.
Colección:McGraw-Hill's AccessEngineering.
Temas:
Multichip modules (Microelectronics) > Design and construction.
Microelectronic packaging.
Electronic books.
Acceso en línea:Texto completo

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