Introduction to system-on-package (SOP) : miniaturization of the entire system /

"System-on-Package (SOP) is an emerging system technology that goes beyond System-on-Chip (SOC) and System-in-Package (SIP) and forms the basis of all emerging digital convergent electronic and bioelectric systems. This book on SOP shows designers how this revolutionary new packaging technology...

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Détails bibliographiques
Cote:Libro Electrónico
Auteur principal: Tummala, Rao R., 1942- (Auteur)
Autres auteurs: Swaminathan, Madhavan, Bandyopadhyay, Tapobrata, Mehendale, Mahesh, Rao, Jagdish, Lee, Baik-Woo, Yoon, Chong K., Brown, Kenneth M., Engin, A. Ege, Govind, Vinu, Bavisi, Amit, Papapolymerou, John, Tentzeris, Manos, Laskar, Joy, Bhattacharya, Swapan, Chang, Gee-Kung, Gaylord, Thomas, Vallalaz, Ricardo, Guidotti, Daniel, Chen, Ray T., Sundaram, Venky, Liu, Fuhan, Krishnan, Ganesh, White, George, Kohl, Paul, Raj, P. Markondeya, Pucha, Raghuram V., Qu, Jianmin, Sitaraman, Suresh K., Monajemi, Pejman, Ayazi, Farrokh, Sparks, Douglas, Zhang, Zhuqing, Li , Y., Wong, C. P., Joshi, Y., Jha, Gopal C., Patterson, M., Dutta, P., Akbay, S. S., Keezer, D., Chatterjee, A., Janagama, Dasharathan G., Liu, Jin, Iyer, Mahadevan K.
Format: Électronique eBook
Langue:Inglés
Publié: New York, N.Y. : McGraw-Hill Education, [2008]
Édition:First edition.
Collection:McGraw-Hill's AccessEngineering.
Sujets:
Multichip modules (Microelectronics) > Design and construction.
Microelectronic packaging.
Electronic books.
Accès en ligne:Texto completo

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