Developments in surface contamination and cleaning : fundamentals and applied aspects /
Surface contamination is of cardinal importance in a host of technologies and industries, ranging from microelectronics to optics to automotive to biomedical. Thus, the need to understand the causes of surface contamination and their removal is very patent. Generally speaking, there are two broad ca...
Clasificación: | Libro Electrónico |
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Otros Autores: | , |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
Norwich, NY :
W. Andrew Pub.,
©2008.
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Temas: | |
Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Introduction
- Part 1: Fundamentals
- The Physical Nature of Very, Very Small Particles and its Impact on their Behavior
- Elucidating the Nature of Very Small Particles
- Transport and Deposition of Aerosol Particles
- Relevance of Particle Transport in Surface Deposition and Cleaning
- Tribological Implications of Particles
- Airborne Molecular Contamination
- Engineering Aspects of Particle Adhesion and Removal
- ESD Controls in Cleanroom Environments: Relevance to Particle Deposition
- Part 2: Characterization of Surface Contaminants
- Electron Microscopy Techniques for Imaging and Analysis of Nanoparticles
- Surface Analysis Methods for Contaminant Identification
- Ionic Contamination and Analytical Techniques for Ionic Contamination
- Relevance of Colorimetric Interferometry for Thin Surface Film Contaminants
- Wettability Techniques to Monitor the Cleanliness of Surfaces
- Part 3: Methods for Removal of Surface Contamination
- The Use of Surfactants to Enhance Particle Removal from Surfaces
- Cleaning with Solvents
- Removal of Particles by Chemical Cleaning
- Cleaning Using High-Speed Impinging Jet
- Microabrasive Precision Cleaning and Processing Technology
- Precision Cleaning Using Microdroplet Beams
- Cleaning Using Argon/Nitrogen Cryogenic Aerosols
- Carbon Dioxide Snow Cleaning
- Coatings for Preventing or Deactivation of Biological Contaminants
- Detailed Study of Semiconductor Wafer Drying.