Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces

This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are s...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Zhang, Qingke (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2016.
Edición:1st ed. 2016.
Colección:Springer Theses, Recognizing Outstanding Ph.D. Research,
Temas:
Mechanics, Applied.
Solids.
Surfaces (Technology).
Thin films.
Mechanics.
Materials-Analysis.
Solid Mechanics.
Surfaces, Interfaces and Thin Film.
Classical Mechanics.
Characterization and Analytical Technique.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Research Progress in Pb-free Soldering
  • Fracture Behavior of IMCs at Cu/Pb-free Solder Interface
  • Tensile-compress Fatigue Behavior of Solder Joints
  • Shear Creep-fatigue Behavior of Cu/Pb-free Solder Joints
  • Thermal Fatigue Behavior of Sn-Ag/Cu Solder Joints
  • Conclusions.

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