Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces

This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are s...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Zhang, Qingke (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Berlin, Heidelberg : Springer Berlin Heidelberg : Imprint: Springer, 2016.
Edición:1st ed. 2016.
Colección:Springer Theses, Recognizing Outstanding Ph.D. Research,
Temas:
Mechanics, Applied.
Solids.
Surfaces (Technology).
Thin films.
Mechanics.
Materials-Analysis.
Solid Mechanics.
Surfaces, Interfaces and Thin Film.
Classical Mechanics.
Characterization and Analytical Technique.
Acceso en línea:Texto Completo

MARC

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100 1 |a Zhang, Qingke.  |e author.  |4 aut  |4 http://id.loc.gov/vocabulary/relators/aut 
245 1 0 |a Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces  |h [electronic resource] /  |c by Qingke Zhang. 
250 |a 1st ed. 2016. 
264 1 |a Berlin, Heidelberg :  |b Springer Berlin Heidelberg :  |b Imprint: Springer,  |c 2016. 
300 |a XV, 143 p. 115 illus., 81 illus. in color.  |b online resource. 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
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490 1 |a Springer Theses, Recognizing Outstanding Ph.D. Research,  |x 2190-5061 
505 0 |a Research Progress in Pb-free Soldering -- Fracture Behavior of IMCs at Cu/Pb-free Solder Interface -- Tensile-compress Fatigue Behavior of Solder Joints -- Shear Creep-fatigue Behavior of Cu/Pb-free Solder Joints -- Thermal Fatigue Behavior of Sn-Ag/Cu Solder Joints -- Conclusions. 
520 |a This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints. 
650 0 |a Mechanics, Applied. 
650 0 |a Solids. 
650 0 |a Surfaces (Technology). 
650 0 |a Thin films. 
650 0 |a Mechanics. 
650 0 |a Materials-Analysis. 
650 1 4 |a Solid Mechanics. 
650 2 4 |a Surfaces, Interfaces and Thin Film. 
650 2 4 |a Classical Mechanics. 
650 2 4 |a Characterization and Analytical Technique. 
710 2 |a SpringerLink (Online service) 
773 0 |t Springer Nature eBook 
776 0 8 |i Printed edition:  |z 9783662488218 
776 0 8 |i Printed edition:  |z 9783662488225 
776 0 8 |i Printed edition:  |z 9783662517253 
830 0 |a Springer Theses, Recognizing Outstanding Ph.D. Research,  |x 2190-5061 
856 4 0 |u https://doi.uam.elogim.com/10.1007/978-3-662-48823-2  |z Texto Completo 
912 |a ZDB-2-ENG 
912 |a ZDB-2-SXE 
950 |a Engineering (SpringerNature-11647) 
950 |a Engineering (R0) (SpringerNature-43712) 

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