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Handbook of VLSI microlithography : principles, technology, and applications /
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings-- including optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme...
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Park Ridge, N.J., U.S.A. :
Noyes Publications,
�1991.
|
| Colección: | Materials science and process technology series.
|
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
| LEADER | 00000cam a2200000 a 4500 | ||
|---|---|---|---|
| 001 | SCIDIR_ocn555773428 | ||
| 003 | OCoLC | ||
| 005 | 20231117032900.0 | ||
| 006 | m o d | ||
| 007 | cr bn||||||abp | ||
| 007 | cr bn||||||ada | ||
| 008 | 100315s1991 njua ob 001 0 eng d | ||
| 010 | |a 90023646 | ||
| 040 | |a OCLCE |b eng |e pn |c OCLCE |d OCLCQ |d OPELS |d OCLCO |d IDEBK |d N$T |d OCLCQ |d OCLCF |d UIU |d YDXCP |d OCLCQ |d LEAUB |d LUN |d OCLCQ |d UKAHL |d OCLCO |d OCLCQ | ||
| 019 | |a 301247721 |a 857467728 |a 1294542020 | ||
| 020 | |a 9781437728224 |q (electronic bk.) | ||
| 020 | |a 1437728227 |q (electronic bk.) | ||
| 020 | |z 9780815512813 | ||
| 020 | |z 0815512813 | ||
| 035 | |a (OCoLC)555773428 |z (OCoLC)301247721 |z (OCoLC)857467728 |z (OCoLC)1294542020 | ||
| 042 | |a dlr | ||
| 050 | 4 | |a TK7874 |b .H3494 1991 | |
| 072 | 7 | |a TEC |x 009070 |2 bisacsh | |
| 082 | 0 | 4 | |a 621.381/531 |2 20 |
| 084 | |a 53.56 |2 bcl | ||
| 084 | |a UP 3100 |2 rvk | ||
| 084 | |a ZN 4170 |2 rvk | ||
| 084 | |a ELT 285f |2 stub | ||
| 245 | 0 | 0 | |a Handbook of VLSI microlithography : |b principles, technology, and applications / |c edited by William B. Glendinning, John N. Helbert. |
| 260 | |a Park Ridge, N.J., U.S.A. : |b Noyes Publications, |c �1991. | ||
| 300 | |a 1 online resource (xxii, 649 pages) : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a Materials science and process technology series | |
| 504 | |a Includes bibliographical references and index. | ||
| 506 | |3 Use copy |f Restrictions unspecified |5 MiAaHDL |2 star | ||
| 533 | |a Electronic reproduction. |b [Place of publication not identified] : |c HathiTrust Digital Library, |d 2010. |5 MiAaHDL | ||
| 538 | |a Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002. |u http://purl.oclc.org/DLF/benchrepro0212 |5 MiAaHDL | ||
| 583 | 1 | |a digitized |c 2010 |h HathiTrust Digital Library |l committed to preserve |5 MiAaHDL |2 pda | |
| 520 | |a This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings-- including optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely covered -- including an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook. | ||
| 588 | 0 | |a Print version record. | |
| 650 | 0 | |a Integrated circuits |x Very large scale integration. | |
| 650 | 0 | |a Microlithography. | |
| 650 | 6 | |a Circuits int�egr�es �a tr�es grande �echelle. |0 (CaQQLa)201-0117255 | |
| 650 | 6 | |a Microlithographie. |0 (CaQQLa)201-0141616 | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Mechanical. |2 bisacsh | |
| 650 | 7 | |a Integrated circuits |x Very large scale integration. |2 fast |0 (OCoLC)fst00975602 | |
| 650 | 7 | |a Microlithography. |2 fast |0 (OCoLC)fst01019883 | |
| 650 | 7 | |a VLSI |2 gnd |0 (DE-588)4117388-0 | |
| 650 | 0 | 7 | |a Lithographie (Halbleitertechnologie) |2 swd |
| 650 | 0 | 7 | |a Photolithographie (Halbleitertechnologie) |2 swd |
| 700 | 1 | |a Glendinning, William B. | |
| 700 | 1 | |a Helbert, John N. | |
| 776 | 0 | 8 | |i Print version: |t Handbook of VLSI microlithography. |d Park Ridge, N.J., U.S.A. : Noyes Publications, �1991 |w (DLC) 90023646 |w (OCoLC)22731519 |
| 830 | 0 | |a Materials science and process technology series. | |
| 856 | 4 | 0 | |u https://sciencedirect.uam.elogim.com/science/book/9780815512813 |z Texto completo |