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Electronics reliability and measurement technology : nondestructive evaluation /

This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.

Bibliographic Details
Call Number:Libro Electrónico
Other Authors: Heyman, Joseph S.
Format: Electronic eBook
Language:Inglés
Published: Park Ridge, N.J., U.S.A. : Noyes Data Corp., �1988.
Subjects:
Online Access:Texto completo
Table of Contents:
  • Measurement Science and Manufacturing Science Research
  • Nondestructive SEM for Surface and Subsurface Wafer Imaging
  • Surface Inspection-Research and Development
  • Wafer Level Reliability for High-Performance VLSI Design
  • Wafer Level Reliability Testing: an Idea Whose Time Has Come
  • Micro-Focus X-Ray Imaging
  • Measurement of Opaque Film Thickness
  • Intelligent Laser Soldering Inspection and Process Control
  • Rupture Testing for the Quality Control of Electrodeposited Copper Interconnections in High-Speed, High-Density Circuits
  • Heterodyne Holographic Interferometry: High-Resolution Ranging and Displacement Measurement
  • Whole Wafer Scanning Electron Microscopy.