Electronics reliability and measurement technology : nondestructive evaluation /

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This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.

Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Heyman, Joseph S.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Park Ridge, N.J., U.S.A. : Noyes Data Corp., �1988.
Temas:
Integrated circuits > Reliability > Congresses.
Nondestructive testing > Congresses.
Integrated circuits > Testing > Congresses.
Circuits int�egr�es > Fiabilit�e > Congr�es.
Contr�ole non destructif > Congr�es.
TECHNOLOGY & ENGINEERING > Electronics > Microelectronics.
TECHNOLOGY & ENGINEERING > Electronics > Digital.
Integrated circuits > Reliability
Integrated circuits > Testing
Nondestructive testing
Elektronik
Elektronische Schaltung
Kongress
Zuverl�assigkeit
proceedings (reports)
Conference papers and proceedings
Conference papers and proceedings.
Actes de congr�es.
Hampton (Va., 1986)
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Measurement Science and Manufacturing Science Research
  • Nondestructive SEM for Surface and Subsurface Wafer Imaging
  • Surface Inspection-Research and Development
  • Wafer Level Reliability for High-Performance VLSI Design
  • Wafer Level Reliability Testing: an Idea Whose Time Has Come
  • Micro-Focus X-Ray Imaging
  • Measurement of Opaque Film Thickness
  • Intelligent Laser Soldering Inspection and Process Control
  • Rupture Testing for the Quality Control of Electrodeposited Copper Interconnections in High-Speed, High-Density Circuits
  • Heterodyne Holographic Interferometry: High-Resolution Ranging and Displacement Measurement
  • Whole Wafer Scanning Electron Microscopy.

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