Electronics reliability and measurement technology : nondestructive evaluation /
This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.
Call Number: | Libro Electrónico |
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Other Authors: | |
Format: | Electronic eBook |
Language: | Inglés |
Published: |
Park Ridge, N.J., U.S.A. :
Noyes Data Corp.,
�1988.
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Subjects: | |
Online Access: | Texto completo |
Table of Contents:
- Measurement Science and Manufacturing Science Research
- Nondestructive SEM for Surface and Subsurface Wafer Imaging
- Surface Inspection-Research and Development
- Wafer Level Reliability for High-Performance VLSI Design
- Wafer Level Reliability Testing: an Idea Whose Time Has Come
- Micro-Focus X-Ray Imaging
- Measurement of Opaque Film Thickness
- Intelligent Laser Soldering Inspection and Process Control
- Rupture Testing for the Quality Control of Electrodeposited Copper Interconnections in High-Speed, High-Density Circuits
- Heterodyne Holographic Interferometry: High-Resolution Ranging and Displacement Measurement
- Whole Wafer Scanning Electron Microscopy.