Advances in Embedded and Fan-Out Wafer Level Packaging Technologies /

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Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 ye...

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Bibliographic Details
Call Number:Libro Electrónico
Main Authors: Keser, Beth (Author), Kroehnert, Steffen (Author)
Corporate Author: Safari, an O'Reilly Media Company
Format: Electronic eBook
Language:Inglés
Published: Wiley-IEEE Press, 2019.
Edition:1st edition.
Subjects:
Chip scale packaging.
Integrated circuits > Wafer-scale integration.
Boîtiers à puce.
Circuits intégrés > Intégration sur la plaquette.
Chip scale packaging
Integrated circuits > Wafer-scale integration
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