Advanced MEMS packaging /

Presenting cutting-edge techniques such as low-temperature C2W and W2W bonding and 3D packaging; this comprehensive guide helps you select reliable; creative; high-performance; robust; and cost-effective packaging techniques for MEMS devices.

Détails bibliographiques
Cote:Libro Electrónico
Autres auteurs: Lau, John H., Lee, Chengkuo, Premachandran, C. S., Aibin, Yu
Format: Électronique eBook
Langue:Inglés
Publié: New York, N.Y. : McGraw-Hill Education, [2010]
Édition:First edition.
Collection:McGraw-Hill's AccessEngineering.
Sujets:
Microelectromechanical systems.
Microelectronic packaging.
Electronic books.
Accès en ligne:Texto completo
Table des matières:
  • Introduction to MEMS
  • Advanced MEMS packaging
  • Enabling technologies for advanced MEMS packaging
  • Advanced MEMS wafer-level packaging
  • Optical MEMS packaging : communications
  • Optical MEMS packaging : bubble switch
  • Optical MEMS : microbolometer packaging
  • Bio-MEMS packaging
  • Biosensor packaging
  • Accelerometer packaging
  • Radiofrequency MEMS switches
  • RF MEMS tunable capacitors and tubable band-pass filters
  • Advanced packaging of RF MEMS devices.

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