Advanced MEMS packaging /

Presenting cutting-edge techniques such as low-temperature C2W and W2W bonding and 3D packaging; this comprehensive guide helps you select reliable; creative; high-performance; robust; and cost-effective packaging techniques for MEMS devices.

Bibliographic Details
Call Number:Libro Electrónico
Other Authors: Lau, John H., Lee, Chengkuo, Premachandran, C. S., Aibin, Yu
Format: Electronic eBook
Language:Inglés
Published: New York, N.Y. : McGraw-Hill Education, [2010]
Edition:First edition.
Series:McGraw-Hill's AccessEngineering.
Subjects:
Microelectromechanical systems.
Microelectronic packaging.
Electronic books.
Online Access:Texto completo

Internet

Texto completo

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