Advanced MEMS packaging /
Presenting cutting-edge techniques such as low-temperature C2W and W2W bonding and 3D packaging; this comprehensive guide helps you select reliable; creative; high-performance; robust; and cost-effective packaging techniques for MEMS devices.
Call Number: | Libro Electrónico |
---|---|
Other Authors: | Lau, John H., Lee, Chengkuo, Premachandran, C. S., Aibin, Yu |
Format: | Electronic eBook |
Language: | Inglés |
Published: |
New York, N.Y. :
McGraw-Hill Education,
[2010]
|
Edition: | First edition. |
Series: | McGraw-Hill's AccessEngineering.
|
Subjects: | |
Online Access: | Texto completo |
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