Advanced MEMS packaging /

Presenting cutting-edge techniques such as low-temperature C2W and W2W bonding and 3D packaging; this comprehensive guide helps you select reliable; creative; high-performance; robust; and cost-effective packaging techniques for MEMS devices.

Détails bibliographiques
Cote:Libro Electrónico
Autres auteurs: Lau, John H., Lee, Chengkuo, Premachandran, C. S., Aibin, Yu
Format: Électronique eBook
Langue:Inglés
Publié: New York, N.Y. : McGraw-Hill Education, [2010]
Édition:First edition.
Collection:McGraw-Hill's AccessEngineering.
Sujets:
Microelectromechanical systems.
Microelectronic packaging.
Electronic books.
Accès en ligne:Texto completo
Description
Résumé:Presenting cutting-edge techniques such as low-temperature C2W and W2W bonding and 3D packaging; this comprehensive guide helps you select reliable; creative; high-performance; robust; and cost-effective packaging techniques for MEMS devices.
Description:Print version c2010.
Description matérielle:1 online resource (xxiii, 552 pages) : illustrations.
Also available in print edition.
Bibliographie:Includes bibliographical references and index.
ISBN:0071741836
9780071626231

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