Advanced MEMS packaging /
Presenting cutting-edge techniques such as low-temperature C2W and W2W bonding and 3D packaging; this comprehensive guide helps you select reliable; creative; high-performance; robust; and cost-effective packaging techniques for MEMS devices.
Cote: | Libro Electrónico |
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Autres auteurs: | , , , |
Format: | Électronique eBook |
Langue: | Inglés |
Publié: |
New York, N.Y. :
McGraw-Hill Education,
[2010]
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Édition: | First edition. |
Collection: | McGraw-Hill's AccessEngineering.
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Sujets: | |
Accès en ligne: | Texto completo |
Résumé: | Presenting cutting-edge techniques such as low-temperature C2W and W2W bonding and 3D packaging; this comprehensive guide helps you select reliable; creative; high-performance; robust; and cost-effective packaging techniques for MEMS devices. |
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Description: | Print version c2010. |
Description matérielle: | 1 online resource (xxiii, 552 pages) : illustrations. Also available in print edition. |
Bibliographie: | Includes bibliographical references and index. |
ISBN: | 0071741836 9780071626231 |