Electronic failure analysis handbook : techniques and applications for electronic and electrical packages, components, and assemblies /

"In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance."--Jacket.

Bibliographic Details
Call Number:Libro Electrónico
Main Author: Martin, Perry L. (Author)
Other Authors: Dylls, D. David, Medora, Noshirwan K., Le May, Ian, Ludwig, Lawrence L., Kaplan, Herbert, Kessler, L. W., Semmens, J. E., Roche, David J., Erickson, J. J., Devaney, John R., Van Westerhuyzen, Dennis H., Vettraino, L. G., Blanchard, Richard A., Galler, Donald, Glover, Duncan, Kusko, Alexander, Loud, John D., Mimmack, Gregory J., Slenski, George, Denson, William, Muller, Gunter, Dunbar, William G.
Format: Electronic eBook
Language:Inglés
Published: New York, N.Y. : McGraw-Hill Education, [2000]
Edition:First edition.
Series:McGraw-Hill's AccessEngineering.
Subjects:
Electronic apparatus and appliances > Reliability.
System failures (Engineering)
Microelectronics.
Semiconductors.
Acoustic imaging.
Infrared photography.
Electron microscopy.
X-ray microscopy.
Metallography.
Semiconductors > Defects.
Solder and soldering.
Printed circuits.
Electronic apparatus and appliances > Defects.
Electronics > Materials > Defects.
Electronic books.
Online Access:Texto completo
Table of Contents:
  • Pt. 1. Introduction to electronic failure analysis
  • pt. 2. Electronic failiure analysis techniques
  • pt. 3. Electronic failure analysis for specific technologies.
  • Ch. 1. Overview of electronic component reliability
  • ch. 2. Overview of electronic systems reliability
  • ch. 3. Product liability
  • ch. 4. Photography and optical microscopy
  • ch. 5. X-ray/radiographic component inspection
  • ch. 6. Infrared thermography
  • ch. 7. Acoustic micro imaging failure analysis of electronic devices
  • ch. 8. Metallography
  • ch. 9. Chemical characterization
  • ch. 10. Electronic and electrical characterization
  • ch. 11. Scanning electron microscopy and x-ray analysis
  • ch. 12. Miscellaneous techniques
  • ch. 13. Solder joints
  • ch. 14. Failure analysis of printed wiring assemblies
  • ch. 15. Wires and cables
  • ch. 16. Switches and relays
  • ch. 17. Connection technology
  • ch. 18. Failure analysis of components
  • ch. 19. Semiconductors
  • ch. 20. Power and high-voltage considerations.

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