Microvias : for low-cost, high-density interconnects /

Annotation.

Bibliographic Details
Call Number:Libro Electrónico
Main Author: Lau, John H. (Author)
Other Authors: Lee, S. W. Ricky
Format: Electronic eBook
Language:Inglés
Published: New York, N.Y. : McGraw-Hill Education, [2001]
Edition:First edition.
Series:McGraw-Hill's AccessEngineering.
Subjects:
Microelectronic packaging.
Multichip modules (Microelectronics)
Flip chip technology.
Printed circuits.
Drilling and boring.
Micro-drilling.
Microelectronics > Materials.
Solder and soldering.
Solder and soldering > Testing.
Microelectronics packaging > Reliability.
Multichip modules (Microelectronics) > Testing.
Integrated circuits > Design and construction > Cost control.
Semiconductors > Junctions.
Electronic books.
Online Access:Texto completo
Table of Contents:
  • Ch. 1. Introduction to Microvia and WLCSP Technologies
  • Ch. 2. Conventional Printed Circuit Board Technologies
  • Ch. 3. Microvias by Mechanical Drilling
  • Ch. 4. Microvias by Laser Drilling
  • Ch. 5. Microvias by Photoimaging
  • Ch. 6. Microvias by Etching
  • Ch. 7. Conductive Paste/Ink-filled Microvias
  • Ch. 8. Special High-Density Interconnects for Flip Chip Applications
  • Ch. 9. Solders for Next-Generation High-Density Interconnects
  • Ch. 10. Solder-Bumped Flip-Chip WLCSP
  • Ch. 11. Assembly of Flip Chip on PCB/Substrate
  • Ch. 12. Solder Joint Reliability of Flip Chip on Microvia PCB/Substrates.

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