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11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /
Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping, Chapter 2: Printing Technologies, Chapter 3: Mat...
| Call Number: | Libro Electrónico |
|---|---|
| Corporate Author: | |
| Other Authors: | |
| Format: | Electronic Conference Proceeding eBook |
| Language: | Inglés |
| Published: |
Pfaffikon, Switzerland :
TTP,
2014.
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| Series: | Advanced materials research ;
v. 1038. |
| Subjects: | |
| Online Access: | Texto completo |