LCP for microwave packages and modules /

A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an o...

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Bibliographic Details
Call Number:Libro Electrónico
Other Authors: Pham, Anh-Vu H., Chen, Morgan J., Aihara, Kunia
Format: Electronic eBook
Language:Inglés
Published: Cambridge ; New York : Cambridge University Press, 2012.
Series:Cambridge RF and microwave engineering series.
Subjects:
Microwave devices > Materials.
Microelectronic packaging > Materials.
Liquid crystal devices.
Polymer liquid crystals.
Dispositifs à micro-ondes > Matériaux.
Mise sous boîtier (Microélectronique) > Matériaux.
Dispositifs à cristaux liquides.
Polymères cristaux liquides.
TECHNOLOGY & ENGINEERING > Microwaves.
Liquid crystal devices
Microelectronic packaging > Materials
Microwave devices > Materials
Polymer liquid crystals
Online Access:Texto completo
Table of Contents:
  • Cover; LCP for Microwave Packages and Modules; Series; Title; Copyright; Contents; Preface; 1: Introduction to electronic package engineering; 1.1 A brief discussion of standard packages; 1.2.2 Weight requirements; 1.2.3 Package physical requirements; 1.2.4 Package thermal requirements; 1.2.6 Package material requirements; 1.3 Package design process; 1.3.1 Technology selection; 1.3.2 Computer-aided design (CAD); 1.3.3 Test and measurement; 1.4 Concluding remarks; 2: Characteristics of liquid crystal polymer (LCP); 2.1 LCP chemistry; 2.1.1 Liquid crystalline characteristics.

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