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Solder Joint Reliability /
The decision to move to lead-free solders has been made, but processing and performance challenges remain. This paper considers the transition in terms of performance, with particular emphasis on long term, high reliability applications. Comparison of key mechanical properties indicates generally be...
| Cote: | Libro Electrónico |
|---|---|
| Auteur principal: | |
| Format: | Électronique eBook |
| Langue: | Inglés |
| Publié: |
Bradford, England :
Emerald Group,
2004.
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| Collection: | Soldering and Surface Mount Technology.
v. 16. |
| Sujets: | |
| Accès en ligne: | Texto completo |