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Design for Manufacturability From 1D to 4D for 90-22 nm Technology Nodes /

This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes.  It is a valuable guide for layout designers, packaging engineers a...

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Détails bibliographiques
Cote:Libro Electrónico
Auteur principal: Balasinski, Artur (Auteur)
Collectivité auteur: SpringerLink (Online service)
Format: Électronique eBook
Langue:Inglés
Publié: New York, NY : Springer New York : Imprint: Springer, 2014.
Édition:1st ed. 2014.
Sujets:
Accès en ligne:Texto Completo