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Power Electronic Packaging Design, Assembly Process, Reliability and Modeling /
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, a...
| Cote: | Libro Electrónico |
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| Auteur principal: | |
| Collectivité auteur: | |
| Format: | Électronique eBook |
| Langue: | Inglés |
| Publié: |
New York, NY :
Springer New York : Imprint: Springer,
2012.
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| Édition: | 1st ed. 2012. |
| Sujets: | |
| Accès en ligne: | Texto Completo |