Power Electronic Packaging Design, Assembly Process, Reliability and Modeling /

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, a...

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Bibliographic Details
Call Number:Libro Electrónico
Main Author: Liu, Yong (Author)
Corporate Author: SpringerLink (Online service)
Format: Electronic eBook
Language:Inglés
Published: New York, NY : Springer New York : Imprint: Springer, 2012.
Edition:1st ed. 2012.
Subjects:
Electric power production.
Electronics.
Condensed matter.
Spectrum analysis.
Electronic circuits.
Electrical Power Engineering.
Electronics and Microelectronics, Instrumentation.
Condensed Matter Physics.
Spectroscopy.
Electronic Circuits and Systems.
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