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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits. It includes details of numerous "manufacturing-ready" GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level an...
| Cote: | Libro Electrónico |
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| Auteur principal: | |
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| Format: | Électronique eBook |
| Langue: | Inglés |
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New York, NY :
Springer New York : Imprint: Springer,
2013.
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| Édition: | 1st ed. 2013. |
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| Accès en ligne: | Texto Completo |