Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits.  It includes details of numerous "manufacturing-ready" GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. Readers will benefit from the sign-off level an...

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Bibliographic Details
Call Number:Libro Electrónico
Main Author: Lim, Sung Kyu (Author)
Corporate Author: SpringerLink (Online service)
Format: Electronic eBook
Language:Inglés
Published: New York, NY : Springer New York : Imprint: Springer, 2013.
Edition:1st ed. 2013.
Subjects:
Electronic circuits.
Microtechnology.
Microelectromechanical systems.
Microprocessors.
Computer architecture.
Electronic Circuits and Systems.
Microsystems and MEMS.
Processor Architectures.
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