RF and Microwave Microelectronics Packaging

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: SpringerLink (Online service)
Otros Autores: Kuang, Ken (Editor ), Kim, Franklin (Editor ), Cahill, Sean S. (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer US : Imprint: Springer, 2010.
Edición:1st ed. 2010.
Temas:
Electronics.
Telecommunication.
Electronic circuits.
Electronics and Microelectronics, Instrumentation.
Microwaves, RF Engineering and Optical Communications.
Electronic Circuits and Systems.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies
  • Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages
  • Polymeric Microelectromechanical Millimeter Wave Systems
  • Millimeter-Wave Chip-on-Board Integration and Packaging
  • Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules
  • RF/Microwave Substrate Packaging Roadmap for Portable Devices
  • Ceramic Systems in Package for RF and Microwave
  • Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications
  • LTCC Substrates for RF/MW Application
  • High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging
  • High Performance Microelectronics Packaging Heat Sink Materials
  • Technology Research on AlN 3D MCM.

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