RF and Microwave Microelectronics Packaging

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in...

Full description

Bibliographic Details
Call Number:Libro Electrónico
Corporate Author: SpringerLink (Online service)
Other Authors: Kuang, Ken (Editor), Kim, Franklin (Editor), Cahill, Sean S. (Editor)
Format: Electronic eBook
Language:Inglés
Published: New York, NY : Springer US : Imprint: Springer, 2010.
Edition:1st ed. 2010.
Subjects:
Electronics.
Telecommunication.
Electronic circuits.
Electronics and Microelectronics, Instrumentation.
Microwaves, RF Engineering and Optical Communications.
Electronic Circuits and Systems.
Online Access:Texto Completo

Internet

Texto Completo

Error inesperado del formato de respuesta.
Holdings details from

Similar Items