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RF and Microwave Microelectronics Packaging
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in...
| Cote: | Libro Electrónico |
|---|---|
| Collectivité auteur: | |
| Autres auteurs: | , , |
| Format: | Électronique eBook |
| Langue: | Inglés |
| Publié: |
New York, NY :
Springer US : Imprint: Springer,
2010.
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| Édition: | 1st ed. 2010. |
| Sujets: | |
| Accès en ligne: | Texto Completo |