Solder Joint Reliability Prediction for Multiple Environments

Solder Joint Reliability Prediction for Multiple Environments provides industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. Th...

Full description

Bibliographic Details
Call Number:Libro Electrónico
Main Authors: Perkins, Andrew E. (Author), Sitaraman, Suresh K. (Author)
Corporate Author: SpringerLink (Online service)
Format: Electronic eBook
Language:Inglés
Published: New York, NY : Springer US : Imprint: Springer, 2009.
Edition:1st ed. 2009.
Subjects:
Electronics.
Metals.
Optical materials.
Security systems.
Electronics and Microelectronics, Instrumentation.
Metals and Alloys.
Optical Materials.
Security Science and Technology.
Online Access:Texto Completo

Internet

Texto Completo

Items no disponibles

Holdings details from

Similar Items