Solder Joint Reliability Prediction for Multiple Environments

Solder Joint Reliability Prediction for Multiple Environments provides industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. Th...

Descripción completa

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Perkins, Andrew E. (Autor), Sitaraman, Suresh K. (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer US : Imprint: Springer, 2009.
Edición:1st ed. 2009.
Temas:
Electronics.
Metals.
Optical materials.
Security systems.
Electronics and Microelectronics, Instrumentation.
Metals and Alloys.
Optical Materials.
Security Science and Technology.
Acceso en línea:Texto Completo

Internet

Texto Completo

Items no disponibles

Detalle de Existencias desde

Ejemplares similares