Solder Joint Reliability Prediction for Multiple Environments

Solder Joint Reliability Prediction for Multiple Environments provides industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. Th...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Perkins, Andrew E. (Autor), Sitaraman, Suresh K. (Autor)
Autor Corporativo: SpringerLink (Online service)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, NY : Springer US : Imprint: Springer, 2009.
Edición:1st ed. 2009.
Temas:
Electronics.
Metals.
Optical materials.
Security systems.
Electronics and Microelectronics, Instrumentation.
Metals and Alloys.
Optical Materials.
Security Science and Technology.
Acceso en línea:Texto Completo
Tabla de Contenidos:
  • Background
  • Literature Review
  • Unified Finite Element Modeling for Prediction of Solder Joint Fatigue
  • Validation of Unified FEM for Thermal Cycling and Power
  • Development of Fatigue Life Equations Under Low-Cycle Thermal and Power Cycling
  • Validation of Unified FEM and Development of Fatigue-life Equations for Vibration
  • Universal Predictive Fatigue Life Equation and the Effect of Design Parameters
  • Acceleration Factor to Relate Thermal Cycles to Power Cycles for CBGA Packages
  • Solder Joint Fatigue Failure under Sequential Thermal and Vibration Environments
  • Solder Joint Reliability Assessment for Desktop and Space Applications.

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