Reliability and failure analysis of high-power led packaging.
Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliabilit...
Clasificación: | Libro Electrónico |
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Autor principal: | Tan, Cher Ming |
Otros Autores: | Singh, Preetpal |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
Cambridge, MA :
Woodhead Publishing Limited,
2022.
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Colección: | Woodhead Publishing series in electronic and optical materials
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Temas: | |
Acceso en línea: | Texto completo |
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