Cargando…

Reliability and failure analysis of high-power led packaging.

Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliabilit...

Descripción completa

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Tan, Cher Ming
Otros Autores: Singh, Preetpal
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Cambridge, MA : Woodhead Publishing Limited, 2022.
Colección:Woodhead Publishing series in electronic and optical materials
Temas:
Acceso en línea:Texto completo

Internet

Texto completo

Items no disponibles

Detalle de Existencias desde