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Advances in chemical mechanical planarization (CMP) /
Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planar...
| Clasificación: | Libro Electrónico |
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| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Duxford, United Kingsom :
Woodhead Publishing,
2022.
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| Edición: | Second edition. |
| Colección: | Woodhead Publishing series in electronic and optical materials.
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| Temas: | |
| Acceso en línea: | Texto completo |