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Advances in chemical mechanical planarization (CMP) /

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planar...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Babu, S. V. (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Duxford, United Kingsom : Woodhead Publishing, 2022.
Edición:Second edition.
Colección:Woodhead Publishing series in electronic and optical materials.
Temas:
Acceso en línea:Texto completo