Electronic enclosures, housings and packages /
Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fu...
Clasificación: | Libro Electrónico |
---|---|
Autor principal: | S�uli, Frank (Autor) |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
Duxford, United Kingdom :
Woodhead Publishing,
[2019]
|
Colección: | Woodhead Publishing series in electronic and optical materials.
|
Temas: | |
Acceso en línea: | Texto completo |
Ejemplares similares
-
Advanced organics for electronic substrates and packages /
Publicado: (1992) -
Hermeticity of electronic packages /
por: Greenhouse, Hal
Publicado: (2012) -
Characterization of integrated circuit packaging materials /
Publicado: (1993) -
Hermeticity of electronic packages /
por: Greenhouse, Hal
Publicado: (2000) -
Newnes electronics assembly handbook /
por: Brindley, Keith
Publicado: (1990)