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Electronic enclosures, housings and packages /

Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fu...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: S�uli, Frank (Autor)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Duxford, United Kingdom : Woodhead Publishing, [2019]
Colección:Woodhead Publishing series in electronic and optical materials.
Temas:
Acceso en línea:Texto completo

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