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Electronic enclosures, housings and packages /
Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fu...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Duxford, United Kingdom :
Woodhead Publishing,
[2019]
|
| Colección: | Woodhead Publishing series in electronic and optical materials.
|
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
| LEADER | 00000cam a2200000 i 4500 | ||
|---|---|---|---|
| 001 | SCIDIR_on1061860542 | ||
| 003 | OCoLC | ||
| 005 | 20231120010324.0 | ||
| 006 | m o d | ||
| 007 | cr cnu|||unuuu | ||
| 008 | 181108s2019 enk ob 001 0 eng d | ||
| 040 | |a N$T |b eng |e rda |e pn |c N$T |d N$T |d OPELS |d OCLCF |d MERER |d OCLCQ |d LQU |d S2H |d OCLCO |d LVT |d OCLCQ |d OCLCO |d K6U |d OCLCQ |d SFB |d OCLCQ |d OCLCO | ||
| 019 | |a 1105186389 |a 1105559568 |a 1229383769 | ||
| 020 | |a 9780081023921 |q (electronic bk.) | ||
| 020 | |a 0081023928 |q (electronic bk.) | ||
| 020 | |a 008102391X | ||
| 020 | |a 9780081023914 | ||
| 020 | |z 9780081023914 | ||
| 035 | |a (OCoLC)1061860542 |z (OCoLC)1105186389 |z (OCoLC)1105559568 |z (OCoLC)1229383769 | ||
| 050 | 4 | |a TK7870.15 | |
| 072 | 7 | |a TEC |x 009070 |2 bisacsh | |
| 082 | 0 | 4 | |a 621.381046 |2 23 |
| 100 | 1 | |a S�uli, Frank, |e author. | |
| 245 | 1 | 0 | |a Electronic enclosures, housings and packages / |c Dr Frank S�uli. |
| 264 | 1 | |a Duxford, United Kingdom : |b Woodhead Publishing, |c [2019] | |
| 300 | |a 1 online resource | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a Woodhead Publishing series in electronic and optical materials | |
| 504 | |a Includes bibliographical references and index. | ||
| 588 | |a Online resource; title from PDF title page (EBSCO, viewed November 9, 2018). | ||
| 520 | |a Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions. | ||
| 650 | 0 | |a Electronic packaging. | |
| 650 | 6 | |a Mise sous bo�itier (�Electronique) |0 (CaQQLa)201-0074280 | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Mechanical. |2 bisacsh | |
| 650 | 7 | |a Electronic packaging |2 fast |0 (OCoLC)fst00907414 | |
| 830 | 0 | |a Woodhead Publishing series in electronic and optical materials. | |
| 856 | 4 | 0 | |u https://sciencedirect.uam.elogim.com/science/book/9780081023914 |z Texto completo |