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Reliability and failure of electronic materials and devices /

"Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Ohring, Milton, 1936-
Otros Autores: Kasprzak, Lucian
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Amsterdam ; Boston : Academic Press is an imprint of Elsevier, 2014.
Edición:Second edition.
Temas:
Acceso en línea:Texto completo (Requiere registro previo con correo institucional)
Tabla de Contenidos:
  • FrontCover; FM-CTR-01; DEDICATION; CONTENTS; Chapter 11
  • Characterization and Failure Analysis of Materials and Devices; PREFACE TO THE FIRST EDITION; 1.1 ELECTRONIC PRODUCTS; 1.3 FAILURE PHYSICS; 1.4 SUMMARY AND PERSPECTIVE; REFERENCES; 2.7 GAAS DEVICES; 2.8 ELECTRO-OPTICAL DEVICES; 2.9 PROCESSING-THE CHIP LEVEL; 2.10 MICROELECTROMECHANICAL SYSTEMS; EXERCISES; REFERENCES; 4.8 EPILOGUE-FINAL COMMENT; EXERCISES; REFERENCES; 5.2 DIFFUSION AND ATOM MOVEMENTS IN SOLIDS; 6.2 ASPECTS OF CONDUCTION IN INSULATORS; 7.2 ATMOSPHERIC CONTAMINATION AND MOISTURE; 8.5 THERMAL STRESSES IN PACKAGE STRUCTURES.
  • 9.2 the nature of contacts11.2 nondestructive examination and decapsulation; 12.2 integrated circuit technology trends; acronyms.