Through-Silicon Vias for 3D Integration /
This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits-essential for the development of low-cost, high-performance electronic and optoelectronic products.
Clasificación: | Libro Electrónico |
---|---|
Autor principal: | Lau, John H. (Autor) |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
New York, N.Y. :
McGraw-Hill Education,
[2013]
|
Edición: | First edition. |
Colección: | McGraw-Hill's AccessEngineering.
|
Temas: | |
Acceso en línea: | Texto completo |
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