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Through-Silicon Vias for 3D Integration /
This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits-essential for the development of low-cost, high-performance electronic and optoelectronic products.
| Clasificación: | Libro Electrónico |
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| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
New York, N.Y. :
McGraw-Hill Education,
[2013]
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| Edición: | First edition. |
| Colección: | McGraw-Hill's AccessEngineering.
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| Temas: | |
| Acceso en línea: | Texto completo |