Cargando…
Through-Silicon Vias for 3D Integration /
This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits-essential for the development of low-cost, high-performance electronic and optoelectronic products.
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
New York, N.Y. :
McGraw-Hill Education,
[2013]
|
| Edición: | First edition. |
| Colección: | McGraw-Hill's AccessEngineering.
|
| Temas: | |
| Acceso en línea: | Texto completo |
| Sumario: | This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits-essential for the development of low-cost, high-performance electronic and optoelectronic products. |
|---|---|
| Descripción Física: | 1 online resource (xxiv, 487 pages) : illustrations. Also available in print edition. |
| Bibliografía: | Includes bibliographical references and index. |
| ISBN: | 9780071785143 (print-ISBN) 0071785140 (print-ISBN) |