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Reliability of RoHS-Compliant 2D and 3D IC interconnects /
"Unique global coverage of RoHS-compliant materials for electronics manufacturing and for packaging assembly and semiconductor integration Reliability of RoHS-Compliant 2D and 3D IC Interconnects provides comprehensive details on RoHS-compliant electronics packaging solder interconnects. This a...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
New York, N.Y. :
McGraw-Hill Education,
[2011]
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| Edición: | First edition. |
| Colección: | McGraw-Hill's AccessEngineering.
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| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Introduction to RoHS-compliant semiconductor and packaging technologies. Reliability engineering of lead-free interconnects. Notes on failure criteria. Reliability of 1657-Pin CCGA lead-free solder joints. Reliability of PBGA lead-free solder joints (with and without Underfills). Reliability of LED lead-free interconnects. Reliability of VCSEL lead-free interconnects. Reliability of low-temperature lead-free (SnBiAg) solder joints. Reliability of lead-free (SACX) solder joints. Chip-to-wafer (C2W) bonding and lead-free interconnect reliability. Wafer-to-wafer (W2W) bonding and lead-free interconnect reliability. Through-silicon-via (TSV) interposer reliability. Electromigration of lead-free microbumps for 3-D IC integration. Effects of dwell[-] time and ramp[-] rate[s] on SAC thermal cycling test results. Effects of high strain rate (impact) on SAC solder balls/bumps. Effects of voids on solder joint[s] reliability.