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Reliability of RoHS-Compliant 2D and 3D IC interconnects /

"Unique global coverage of RoHS-compliant materials for electronics manufacturing and for packaging assembly and semiconductor integration Reliability of RoHS-Compliant 2D and 3D IC Interconnects provides comprehensive details on RoHS-compliant electronics packaging solder interconnects. This a...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Lau, John H. (Autor)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, N.Y. : McGraw-Hill Education, [2011]
Edición:First edition.
Colección:McGraw-Hill's AccessEngineering.
Temas:
Acceso en línea:Texto completo