Reliability of RoHS-Compliant 2D and 3D IC interconnects /
"Unique global coverage of RoHS-compliant materials for electronics manufacturing and for packaging assembly and semiconductor integration Reliability of RoHS-Compliant 2D and 3D IC Interconnects provides comprehensive details on RoHS-compliant electronics packaging solder interconnects. This a...
Clasificación: | Libro Electrónico |
---|---|
Autor principal: | Lau, John H. (Autor) |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
New York, N.Y. :
McGraw-Hill Education,
[2011]
|
Edición: | First edition. |
Colección: | McGraw-Hill's AccessEngineering.
|
Temas: | |
Acceso en línea: | Texto completo |
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