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Reliability of RoHS-Compliant 2D and 3D IC interconnects /
"Unique global coverage of RoHS-compliant materials for electronics manufacturing and for packaging assembly and semiconductor integration Reliability of RoHS-Compliant 2D and 3D IC Interconnects provides comprehensive details on RoHS-compliant electronics packaging solder interconnects. This a...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
New York, N.Y. :
McGraw-Hill Education,
[2011]
|
| Edición: | First edition. |
| Colección: | McGraw-Hill's AccessEngineering.
|
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
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| 010 | |z 2010040873 | ||
| 020 | |a 0071773339 | ||
| 020 | |a 9780071753791 | ||
| 035 | |a (OCoLC)701052789 | ||
| 040 | |a IN-ChSCO |b eng |e rda | ||
| 041 | 0 | |a eng | |
| 050 | 4 | |a TK7874.53 | |
| 082 | 0 | 4 | |a 621.381/046 |2 22 |
| 100 | 1 | |a Lau, John H., |e author. | |
| 245 | 1 | 0 | |a Reliability of RoHS-Compliant 2D and 3D IC interconnects / |c John H. Lau. |
| 250 | |a First edition. | ||
| 264 | 1 | |a New York, N.Y. : |b McGraw-Hill Education, |c [2011] | |
| 264 | 4 | |c ?2011 | |
| 300 | |a 1 online resource (xxix, 606 pages) : |b illustrations. | ||
| 336 | |a text |2 rdacontent | ||
| 337 | |a computer |2 rdamedia | ||
| 338 | |a online resource |2 rdacarrier | ||
| 490 | 1 | |a McGraw-Hill's AccessEngineering | |
| 500 | |a Print version c2011. | ||
| 504 | |a Includes bibliographical references and index. | ||
| 505 | 0 | |a Introduction to RoHS-compliant semiconductor and packaging technologies. Reliability engineering of lead-free interconnects. Notes on failure criteria. Reliability of 1657-Pin CCGA lead-free solder joints. Reliability of PBGA lead-free solder joints (with and without Underfills). Reliability of LED lead-free interconnects. Reliability of VCSEL lead-free interconnects. Reliability of low-temperature lead-free (SnBiAg) solder joints. Reliability of lead-free (SACX) solder joints. Chip-to-wafer (C2W) bonding and lead-free interconnect reliability. Wafer-to-wafer (W2W) bonding and lead-free interconnect reliability. Through-silicon-via (TSV) interposer reliability. Electromigration of lead-free microbumps for 3-D IC integration. Effects of dwell[-] time and ramp[-] rate[s] on SAC thermal cycling test results. Effects of high strain rate (impact) on SAC solder balls/bumps. Effects of voids on solder joint[s] reliability. | |
| 520 | |a "Unique global coverage of RoHS-compliant materials for electronics manufacturing and for packaging assembly and semiconductor integration Reliability of RoHS-Compliant 2D and 3D IC Interconnects provides comprehensive details on RoHS-compliant electronics packaging solder interconnects. This authoritative guide aids in developing innovative, high-performance, cost-effective, and reliable lead-free interconnects for electronics and optoelectronic products. Reliability of RoHS-Compliant 2D and 3D IC Interconnects Covers chip-level interconnect reliability, first- and second-level interconnect reliability, and 3D IC integration interconnect reliability Addresses challenging problems created by increasing interest in lead-free interconnect reliability of 3D packaging and 3D IC integration Provides information fundamental to research and development of design (mechanical, optical, electrical, and thermal); materials; process; manufacturing; testing; and reliability for lead-free interconnects in RoHS-compliant electronics products Removes road blocks to, avoids unnecessary false starts in, and accelerates design, materials, and process development in packaging technology In-depth details: Introduction to RoHS Compliant Semiconductor and Packaging Technologies; Reliability Engineering of Lead-Free Interconnects; Notes on Failure Criterion; Reliability of 1657-Pin CCGA Lead-Free Solder Joints; Reliability of PBGA Lead-Free Solder Joints; Reliability of LED Lead-Free Interconnects; Reliability of VCSEL Lead-Free Interconnects; Reliability of Low-Temperature Lead-Free (SnBiAg) Solder Joints; Reliability of Lead-Free (SACX) Solder Joints; Chip-to-Wafer (C2W) Lead-Free Interconnect Reliability; Wafer-to-Wafer (W2W) Lead-Free Interconnect Reliability; Through-Silicon-Via (TSV) Interposer Lead-Free Interconnect Reliability; Electromigration of Lead-Free Microbumps for 3D IC Integrations; Effects of Dwell-Time and Ramp-Rates on SAC Thermal Cycling Test Results; Effects of High Strain Rate (Impact) on SAC Solder Bumps; Effects of Voids on Solder Joints Reliability"--Provided by publisher. | ||
| 520 | |a "Reliability of RoHS-Compliant 2D and 3D IC Interconnects provides comprehensive coverage of RoHS-compliant electronics packaging solder interconnects. RoHS--the restriction of the use of certain hazardous substances in electrical and electronic equipment--is law in the EU, China, Japan, Korea, Canada, Australia, California, etc. RoHS bans lead and five other materials; thus, in order to ship electrical products to these regions and countries, products must be lead-free. The material in this book aids in developing innovative, high-performance, cost-effective, and reliable lead-free interconnects for electronics and optoelectronic products"--Provided by publisher. | ||
| 530 | |a Also available in print edition. | ||
| 533 | |a Electronic reproduction. |b New York, N.Y. : |c McGraw Hill, |d 2011. |n Mode of access: World Wide Web. |n System requirements: Web browser. |n Access may be restricted to users at subscribing institutions. | ||
| 538 | |a Mode of access: Internet via World Wide Web. | ||
| 546 | |a In English. | ||
| 588 | |a Description based on cover image and table of contents, viewed on April 19, 2011. | ||
| 650 | 0 | |a Interconnects (Integrated circuit technology) |x Reliability. | |
| 650 | 0 | |a Green technology |x Reliability. | |
| 655 | 0 | |a Electronic books. | |
| 740 | 0 | 2 | |a Introduction to RoHS-compliant semiconductor and packaging technologies. |
| 740 | 0 | 2 | |a Reliability engineering of lead-free interconnects. |
| 740 | 0 | 2 | |a Notes on failure criteria. |
| 740 | 0 | 2 | |a Reliability of 1657-Pin CCGA lead-free solder joints. |
| 740 | 0 | 2 | |a Reliability of PBGA lead-free solder joints (with and without Underfills). |
| 740 | 0 | 2 | |a Reliability of LED lead-free interconnects. |
| 740 | 0 | 2 | |a Reliability of VCSEL lead-free interconnects. |
| 740 | 0 | 2 | |a Reliability of low-temperature lead-free (SnBiAg) solder joints. |
| 740 | 0 | 2 | |a Reliability of lead-free (SACX) solder joints. |
| 740 | 0 | 2 | |a Chip-to-wafer (C2W) bonding and lead-free interconnect reliability. |
| 740 | 0 | 2 | |a Wafer-to-wafer (W2W) bonding and lead-free interconnect reliability. |
| 740 | 0 | 2 | |a Through-silicon-via (TSV) interposer reliability. |
| 740 | 0 | 2 | |a Electromigration of lead-free microbumps for 3-D IC integration. |
| 740 | 0 | 2 | |a Effects of dwell[-] time and ramp[-] rate[s] on SAC thermal cycling test results. |
| 740 | 0 | 2 | |a Effects of high strain rate (impact) on SAC solder balls/bumps. |
| 740 | 0 | 2 | |a Effects of voids on solder joint[s] reliability. |
| 776 | 0 | |i Print version: |t Reliability of RoHS-Compliant 2D and 3D IC interconnects. |b First edition. |d New York, N.Y. : McGraw-Hill Education, 2011 |w (OCoLC)659763935 | |
| 830 | 0 | |a McGraw-Hill's AccessEngineering. | |
| 856 | 4 | 0 | |u https://accessengineeringlibrary.uam.elogim.com/content/book/9780071753791 |z Texto completo |
| 997 | |a (c)2011 Cassidy Cataloguing Services, Inc. | ||