Electronic failure analysis handbook : techniques and applications for electronic and electrical packages, components, and assemblies /

"In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance."--Jacket.

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Martin, Perry L. (Autor)
Otros Autores: Dylls, D. David, Medora, Noshirwan K., Le May, Ian, Ludwig, Lawrence L., Kaplan, Herbert, Kessler, L. W., Semmens, J. E., Roche, David J., Erickson, J. J., Devaney, John R., Van Westerhuyzen, Dennis H., Vettraino, L. G., Blanchard, Richard A., Galler, Donald, Glover, Duncan, Kusko, Alexander, Loud, John D., Mimmack, Gregory J., Slenski, George, Denson, William, Muller, Gunter, Dunbar, William G.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, N.Y. : McGraw-Hill Education, [2000]
Edición:First edition.
Colección:McGraw-Hill's AccessEngineering.
Temas:
Electronic apparatus and appliances > Reliability.
System failures (Engineering)
Microelectronics.
Semiconductors.
Acoustic imaging.
Infrared photography.
Electron microscopy.
X-ray microscopy.
Metallography.
Semiconductors > Defects.
Solder and soldering.
Printed circuits.
Electronic apparatus and appliances > Defects.
Electronics > Materials > Defects.
Electronic books.
Acceso en línea:Texto completo

MARC

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020 |a 0070410445 (print-ISBN) 
020 |a 0071449639 
020 |a 9780070410442 
035 |a (OCoLC)746484254 
040 |a IN-ChSCO  |b eng  |e rda 
041 0 |a eng 
050 4 |a TK7870.23 
082 0 4 |a 621.381  |2 22 
100 1 |a Martin, Perry L.,  |e author. 
245 1 0 |a Electronic failure analysis handbook :  |b techniques and applications for electronic and electrical packages, components, and assemblies /  |c Perry L. Martin. 
250 |a First edition. 
264 1 |a New York, N.Y. :  |b McGraw-Hill Education,  |c [2000] 
264 4 |c ?2000 
300 |a 1 online resource (520 pages) :  |b illustrations. 
336 |a text  |2 rdacontent 
337 |a computer  |2 rdamedia 
338 |a online resource  |2 rdacarrier 
490 1 |a McGraw-Hill's AccessEngineering 
500 |a Print version c1999. 
504 |a Includes bibliographical references and index. 
505 0 |a Pt. 1. Introduction to electronic failure analysis -- pt. 2. Electronic failiure analysis techniques -- pt. 3. Electronic failure analysis for specific technologies. 
505 0 |a Ch. 1. Overview of electronic component reliability -- ch. 2. Overview of electronic systems reliability -- ch. 3. Product liability -- ch. 4. Photography and optical microscopy -- ch. 5. X-ray/radiographic component inspection -- ch. 6. Infrared thermography -- ch. 7. Acoustic micro imaging failure analysis of electronic devices -- ch. 8. Metallography -- ch. 9. Chemical characterization -- ch. 10. Electronic and electrical characterization -- ch. 11. Scanning electron microscopy and x-ray analysis -- ch. 12. Miscellaneous techniques -- ch. 13. Solder joints -- ch. 14. Failure analysis of printed wiring assemblies -- ch. 15. Wires and cables -- ch. 16. Switches and relays -- ch. 17. Connection technology -- ch. 18. Failure analysis of components -- ch. 19. Semiconductors -- ch. 20. Power and high-voltage considerations. 
520 0 |a "In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance."--Jacket. 
530 |a Also available in print edition. 
533 |a Electronic reproduction.  |b New York, N.Y. :  |c McGraw Hill,   |d 2000.  |n Mode of access: World Wide Web.  |n System requirements: Web browser.  |n Access may be restricted to users at subscribing institutions. 
538 |a Mode of access: Internet via World Wide Web. 
546 |a In English. 
588 |a Description based on cover image and table of contents, viewed on April 23, 2007. 
650 0 |a Electronic apparatus and appliances  |x Reliability. 
650 0 |a System failures (Engineering) 
650 0 |a Microelectronics. 
650 0 |a Semiconductors. 
650 0 |a Acoustic imaging. 
650 0 |a Infrared photography. 
650 0 |a Electron microscopy. 
650 0 |a X-ray microscopy. 
650 0 |a Metallography. 
650 0 |a Semiconductors  |x Defects. 
650 0 |a Solder and soldering. 
650 0 |a Printed circuits. 
650 0 |a Electronic apparatus and appliances  |x Defects. 
650 0 |a Electronics  |x Materials  |x Defects. 
655 0 |a Electronic books. 
700 1 |a Dylls, D. David. 
700 1 |a Medora, Noshirwan K. 
700 1 |a Le May, Ian. 
700 1 |a Ludwig, Lawrence L. 
700 1 |a Kaplan, Herbert. 
700 1 |a Kessler, L. W. 
700 1 |a Semmens, J. E. 
700 1 |a Roche, David J. 
700 1 |a Erickson, J. J. 
700 1 |a Devaney, John R. 
700 1 |a Van Westerhuyzen, Dennis H. 
700 1 |a Vettraino, L. G. 
700 1 |a Blanchard, Richard A. 
700 1 |a Galler, Donald. 
700 1 |a Glover, Duncan. 
700 1 |a Kusko, Alexander. 
700 1 |a Loud, John D. 
700 1 |a Mimmack, Gregory J. 
700 1 |a Slenski, George. 
700 1 |a Denson, William. 
700 1 |a Muller, Gunter. 
700 1 |a Dunbar, William G. 
740 0 2 |a Introduction to electronic failure analysis. 
740 0 2 |a Overview of electronic systems reliability. 
740 0 2 |a Product liability. 
740 0 2 |a Photography and optical microscopy. 
740 0 2 |a X-ray/radiographic component inspection. 
740 0 2 |a Infrared thermography. 
740 0 2 |a Acoustic micro imaging failure analysis of electronic devices. 
740 0 2 |a Metallography. 
740 0 2 |a Chemical characterization. 
740 0 2 |a Electronic and electrical characterization. 
740 0 2 |a Scanning electron microscopy and x-ray analysis. 
740 0 2 |a Miscellaneous techniques. 
740 0 2 |a Solder joints. 
740 0 2 |a Failure analysis of printed wiring assemblies. 
740 0 2 |a Wires and cables. 
740 0 2 |a Switches and relays. 
740 0 2 |a Connection technology. 
740 0 2 |a Semiconductors. 
740 0 2 |a Power and high-voltage considerations. 
776 0 |i Print version:   |t Electronic failure analysis handbook : techniques and applications for electronic and electrical packages, components, and assemblies.  |b First edition.  |d New York, N.Y. : McGraw-Hill Education, 2000  |w (OCoLC)41255376 
830 0 |a McGraw-Hill's AccessEngineering. 
856 4 0 |u https://accessengineeringlibrary.uam.elogim.com/content/book/9780070410442  |z Texto completo 
997 |a (c)2007 Cassidy Cataloguing Services, Inc. 

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