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Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition /

Detalles Bibliográficos
Clasificación:	Libro Electrónico
Autor principal:	Tummala, Rao (Autor)
Formato:	Electrónico eBook
Idioma:	Inglés
Publicado:	New York, N.Y. : McGraw-Hill Education, [2019].
Edición:	2nd edition.
Temas:	Microelectronic packaging. TECHNOLOGY & ENGINEERING / Electrical. Electronic books.
Acceso en línea:	Texto completo

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