Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition /

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Tummala, Rao (Autor)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York, N.Y. : McGraw-Hill Education, [2019].
Edición:2nd edition.
Temas:
Microelectronic packaging.
TECHNOLOGY & ENGINEERING / Electrical.
Electronic books.
Acceso en línea:Texto completo

MARC

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010 |a 2019944553 
020 |a 9781259861567 (e-ISBN) 
020 |a 1259861562 (e-ISBN) 
020 |a 9781259861550 (print-ISBN) 
020 |a 1259861554 (print-ISBN) 
035 |a (OCoLC)1124797429 
040 |a IN-ChSCO  |b eng  |e rda 
041 0 |a eng 
050 4 |a TK7870.15 
072 7 |a TEC  |x 007000   |2 bisacsh 
082 0 4 |a 621.381  |2 23 
100 1 |a Tummala, Rao,   |e author. 
245 1 0 |a Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition /   |c Rao Tummala. 
250 |a 2nd edition. 
264 1 |a New York, N.Y. :   |b McGraw-Hill Education,   |c [2019]. 
264 4 |c ?2019. 
300 |a 1 online resource (849 pages) :   |b 550 illustrations. 
336 |a text  |2 rdacontent 
337 |a computer  |2 rdamedia 
338 |a online resource  |2 rdacarrier 
504 |a Includes bibliographical references and index. 
505 0 |a Cover --   |t Title Page --   |t Copyright Page --   |t Dedication --   |t Contents --   |t Contributors --   |t Preface --   |t 1 Introduction to Device and Systems Packaging Technologies --   |t 1.1 What Is Packaging and Why? --   |t 1.2 Anatomy of an Electronic Packaged System from a Packaging Point of View --   |t 1.3 Devices and Moore?s Law --   |t 1.4 Electronic Technology Waves: Microelectronics, RF/Wireless, Photonics, MEMS, and Quantum Devices --   |t 1.5 Packaging and Moore?s Law for Packaging --   |t 1.6 Electronic Systems Technologies Trends --   |t 1.7 Future Outlook --   |t 1.8 How the Book Is Organized --   |t 1.9 Homework Problems --   |t 1.10 Suggested Reading --   |t Part 1 Fundamentals of Packaging --   |t 2 Fundamentals of Electrical Design for Signals, Power, and Electromagnetic Interference --   |t 3 Fundamentals of Thermal Technologies --   |t 4 Fundamentals of Thermo-Mechanical Reliability --   |t 5 Fundamentals of Package Materials at Microscale and Nanoscale --   |t 6 Fundamentals of Ceramic, Organic, Glass, and Silicon Package Substrates --   |t 7 Fundamentals of Passive Components and Integration with Active Devices --   |t 8 Fundamentals of Chip-to-Package Interconnections and Assembly --   |t 9 Fundamentals of Embedded and Fan-Out Packaging --   |t 10 Fundamentals of 3D Packaging with and without TSV --   |t 11 Fundamentals of RF and Millimeter-Wave Packaging --   |t 12 Fundamentals of Optoelectronics Packaging --   |t 13 Fundamentals of MEMS and Sensor Packaging --   |t 14 Fundamentals of Package Encapsulation, Molding, and Sealing --   |t 15 Fundamentals of Printed Wiring Boards --   |t 16 Fundamentals of Board Assembly --   |t Part 2 Applications of Packaging Technologies --   |t 17 Applications of Packaging Technologies in Future Car Electronics --   |t 18 Applications of Packaging Technologies in Bioelectronics --   |t 19 Applications of Packaging Technologies in Communication Systems --   |t 20 Applications of Packaging Technologies in Computing Systems --   |t 21 Applications of Packaging Technologies in Flexible Electronics --   |t 22 Applications of Packaging Technologies in Smartphones --   |t Index. 
530 |a Also available in print edition. 
533 |a Electronic reproduction.   |b New York, N.Y. :   |c McGraw Hill,   |d 2019.   |n Mode of access: World Wide Web.   |n System requirements: Web browser.   |n Access may be restricted to users at subscribing institutions. 
538 |a Mode of access: Internet via World Wide Web. 
546 |a In English. 
588 |a Description based on e-Publication PDF. 
650 0 |a Microelectronic packaging.  
650 7 |a TECHNOLOGY & ENGINEERING / Electrical.  |2 bisacsh 
655 0 |a Electronic books. 
776 0 |i Print version:   |t Fundamentals of Device and Systems Packaging: Technologies and Applications,   |b Second Edition,   |d New York, N.Y. : McGraw Hill,   |c [2019],   |z 9781259861550,   |w (OCLC)1124797429 
856 4 0 |u https://accessengineeringlibrary.uam.elogim.com/content/book/9781259861550  |z Texto completo 

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