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SiC power module design performance, robustness and reliability
Wide Bandgap semiconductor devices offer higher efficiency, smaller size, less weight, and longer lifetime, with applications in power grid electronics and electromobility. This book describes the state of advanced packaging solutions for novel wide-band-gap semiconductors, specifically silicon carb...
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
London, United Kingdom
The Institution of Engineering and Technology
2021
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| Colección: | IET energy engineering series ;
151. |
| Temas: | |
| Acceso en línea: | Texto completo |