RF and Microwave Module Level Design and Integration /

This book is intended to bring together fundamental concepts and elements needed in the design, integration, and characterization phases of modern radio frequency (RF) and microwave modules and to familiarize the interested reader with the common challenges in this rapidly changing field. While desi...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Almalkawi, Mohammad (Autor)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: London : The Institution of Engineering and Technology, 2019.
Colección:Materials, circuits and devices series ; 34.
Temas:
Computer-aided design.
Electric circuits.
Electric networks, Passive.
Electronic circuit design.
Electronic packaging.
Impedance matching.
Lumped elements (Electronics)
Microwave circuits.
Conception assistée par ordinateur.
Circuits électriques.
Réseaux passifs (Télécommunications)
Circuits électroniques > Calcul.
Mise sous boîtier (Électronique)
Adaptation d'impédance.
Constantes localisées (Électronique)
Circuits pour micro-ondes.
computer-aided designs (visual works)
circuits.
computer-aided design (process)
Computer-aided design
Electric circuits
Electric networks, Passive
Electronic circuit design
Electronic packaging
Impedance matching
Microwave circuits
circuit CAD.
electromagnetic coupling.
electronics packaging.
impedance matching.
lumped parameter networks.
microwave circuits.
modules.
passive networks.
RF front-end modules
module-level measurements
component-level measurements
RF circuits
CAD
microwave circuits
electromagnetic field couplings
impedance matching networks
microwave network analysis
distributed passive elements
lumped passive elements
microwave device
RF device
device packaging
module packaging
Acceso en línea:Texto completo
Descripción
Sumario:This book is intended to bring together fundamental concepts and elements needed in the design, integration, and characterization phases of modern radio frequency (RF) and microwave modules and to familiarize the interested reader with the common challenges in this rapidly changing field. While design for manufacturability (DFM) and design for testability (DFT) are two important practices that stress the need for careful attention at the early design stages of a product, module integration to achieve optimal RF performance is an art form that takes years to master. In this context, the objective of this book is to provide the necessary practical and theoretical background needed to tackle a multitude of issues accompanied by the design of contemporary RF modules. The topics covered can serve a broad range of individuals: those just entering the field, graduate-level students, and researchers, as well as practicing engineers seeking new domains to expand their knowledge, understand design tradeoffs, and looking for a quick guide in digesting the several aspects of the RF module design processes and their common challenges. The book comprises eight chapters which discuss: packaging, lumped and distributed passive elements, microwave network analysis, impedance matching networks, electromagnetic field couplings, CAD, components of RF front-end modules, component- and module-level measurements.
Descripción Física:1 online resource (337 pages)
ISBN:178561360X
9781785613609

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